Workshop“CECAM-Fluids in porous materials: from fundamental physics to engineering applications”

Workshop“CECAM-Fluids in porous materials: from fundamental physics to engineering applications”

Between 19th and 21st June 2023 the Workshop entitled “CECAM-Fluids in porous materials: from fundamental physics to engineering applications” was held in presence, in Lausanne, Switzerland.

The objective of this workshop is to gather experimentalists and theoreticians to discuss fundamental and technological aspects of intrusion/extrusion/evaporation in system with complex chemistry and topology, including:

Fundamental questions on the intrusion/extrusion/evaporation mechanism, energetics, and kinetics in complex porous systems: disordered grafted porous systems, metal- or covalent-organic framework, porous polymeric materials, soft porous media – biological channels.

Challenges in the simulation of intrusion/extrusion/evaporation: quasi-static (e.g., string method) vs “dynamical” methods (e.g., transition interface sampling), and multiscale aspects in time and space in general.

Challenges in the experimental investigation of intrusion/extrusion/evaporation: in situ structural measurements, heat flux, charging/discharging of the liquid/solid interface, ionic conduction across nanopores, stability of ultrathin liquid films.

Identify possible novel technological applications of these systems and establishing collaborations among the participants to tackle them.

Organizers: A. Giacomello, Y. Grosu (Electro Intrusion), S. Meloni (Electro Intrusion), A. Yaroshchuk. Intro by organisers-CECAM Workshop "FLUIDS IN POROUS MATERIALS"

Speakers: F. Rasera, F. Caupin, E. Charlaix, B. Coasne, C. Corsini, S. Dutta, M. Isaiev, A. Obliger, C. Picard, B. Rotenberg, O. Ryzhikov, P. Huber, R. Roth, A. Schlaich, P. Asinari, S. Cambiaso, A. Giacomello, P. Guglielmini, J. D. Littlefair (Electro Intrusion), S. Meloni (Electro Intrusion), D. Secci, A.Tinti, P. Bolhuis, L. Bartolomé (Electro Intrusion), Y. Grosu (Electro Intrusion), A. Yaroshchuk, S. Babiy, A. L. N. Ngambia, M. Suetin, Y. Sun, J-C. Tan, A. Neimark, R. Remsing .